planarSPUTTER-400C Multi-Target Sputtering System
The planarSPUTTER-400C is a multi-target sputtering system designed to deliver premium performance for limited budgets. This customized system is capable of depositing multiple layers of metallic and dielectric thin-films; it supports both sequential deposition and co-sputtering and can host up to four targets. This system offers some unique features designed to optimize deposition uniformity and is fitted with a heating substrate stage that can reach a maximum temperature of 500°C and provisions to accommodate both 2” and 4” wafers, as well as small substrates. planarTECH’s National Instruments LabVIEW based PC-controlled software is user-friendly and utilizes a large 19” Samsung LCD display; the process control system allows the user to operate in either the manual or the automatic mode. “1 Click” fully automated operation is also supported. Other unique features include:
- Multi-target sputtering system with 4” sputter guns for R&D and small-scale production;
- Optimized configurations of sputter guns and shutter to minimize cross-contamination between installed targets;
- Reference process data of various deposition materials can be provided to the customer free of charge;
planarPLASMA ICP-RIE 300-C product specification
MAIN CHAMBER UNIT
• Chamber Size: SUS304, 630(OD)x480(H)mm • Pumping Port: 135(R)x100(H)mm • 5” Viewport and Manual Viewport Shutter • Gas Feeding Port: CF070 • Three 4” Gun Port & Pneumatic Gun Shutters • Coating Shield SUS304 • Leak Rate: 8E-9 mbarl/sec LOAD LOCK CHAMBER UNIT • Loadlock Chamber Size: 350x250x80mm • 5” Viewport & Manual Door Hinge • Pfeiffer Low Vacuum Sensor • ATM Sensor • 25W Reversible Moving Motor with Position Sensor • 6” Pneumatic Isolation Valve • KF25 Pneumatic Roughing Valve • ¼” VCR Pneumatic Vent Valve • Pfeiffer 450l/min Dry Pump • Leak Rate: 8E-9 mbarl/sec SUBSTRATE ROTATION & HEATING UNIT • Substrate Holder: 2” and 4” Wafer(s) • Substrate Rotation: 40W Brake Motor • Rotation Seal: Ferro-magnetic Seal • Rotation Speed: 10-60rpm • Water-cooled Heating Block • 5” SiC Susceptor • Coaxial-type Bias Feed-through • RF 300W with Auto. Network for Sample Clean • Max. 500°C Heater & K-type Thermocouple SPUTTER SOURCE UNIT • 4” Sputter Guns; Up-sputtering Configuration • Target Size: 4” x ¼” & Cu Gun Body • Cylinder Type Nd-Fe-B Magnet • Target Clamp & Ground Shield • 20° Tilting Angle • 600W & 300W RF with Auto. Matching Network (Youngsin RF) • 1500W DC (SJ Power) • Uniformity Guarantee: ~3% (5mm edge exclusion) VACUUM & PUMPING UNIT • 750l/min Dry Pump • 900l/sec Pfeiffer Turbo-molecular Pump • KF40 Exhaust Flange & Pneumatic Main Valve • KF40 Pneumatic Roughing & Fore-line Valves • ¼” VCR Pneumatic Vent Valve • ISO160 Automatic Pressure Control Valve • MKS Baratron 0.1 Torr & Controller & Throttle Valve • Drive Chamber: 6”x160(H)mm • KF40 Flexible Tubes & Q-clamp Line Fitting • AtoVac CG201-N Convection Gauge • AtoVac CG2000 Convection Gauge Controller • AtoVac 4336-K High Vacuum Sensor & Controller GAS SUPPLY UNIT • Three (3) Celerity TN2900 Mass Flow Controllers o Argon (Ar): 100 sccm o Nitrogen (N2): 100 sccm o Oxygen (O2): 50 sccm • One Open Mounting Bay for Additional MFC • MFC Read-out on PC Display • Gas Bellows Valve • E/P Tube & All VCR Fittings ELECTRICAL CONTROL UNIT • MS Windows XP Pro Embedded PC o Intel Core2Duo E5700 3.0G o Supermicro C2SBC-Q o Samsung 2GB PC6400 o LG DVD-Multi o MS Windows XP Pro Embedded o Samsung 19” Display (E1920R) • PLC Module with National Inst. LabVIEW Interface • Recipe Open/Save Function & Auto Process Mode • Safety Controls: Water and Air with Pressure Switch • Gas Valve Control & Vacuum Gauge Control |
Example of a planarSPUTTER System
(Note: This image shows a planarSPUTTER-3C with 3” Sputter Guns. The planarSPUTTER-400C is larger in size.) Process Control Interface: Fully-Automated PC Control with LabVIEW Front End
Example planarSPUTTER Process Results
(Note: 33 Measurement points (edge 10mm); Thickness Uniformity ±1.63% from 187nm.) SYSTEM SIZE & UTILITY REQUIREMENT
• Weight: approx. 1.5 to 2 tons • Footprint: approx. 2,000(W)x1,700(D)x2,000(H)mm • Power: 400V, 3-phase, 50 Hz |
references
The planarSPUTTER product line has a wide install base in Korea. The reference sites using the same or similar sputtering systems for metal and dielectric deposition include: Samsung SDI, SKKU, Korea University, Inha University, and many others.
standard warranty
Each planarSPUTTER system is delivered with a standard warranty that covers all parts for one (1) year from the date of delivery to the customer site. Any defects in materials or workmanship during the warranty period will be remedied by repair or replacement free of charge.
on-site setup & training
After delivery, planarTECH or its local representative/distributor will send a technical team to the customer site to perform proper installation of the planarSPUTTER system, verification of its operation and a quality check. This installation process typically takes one to two days to complete. After successful setup of the planarSPUTTER system, planarTECH or its local representative/distributor will provide on-site training in the operation and use of the system.
shipping policy
planarTECH ships each planarSPUTTER system to the customer site by Incoterms CIP (Carriage & Insurance Paid) air freight direct from its factory in Korea. The cost of shipping is included in the base price. Typical lead time is 10-14 weeks after receipt of order.